Patent Assignment Details
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| Reel/Frame: | 026345/0704 | |
| Pages: | 4 |
| | Recorded: | 05/26/2011 | | |
| Attorney Dkt #: | 22171-00135 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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13116432
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Filing Dt:
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05/26/2011
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Publication #:
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Pub Dt:
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11/29/2012
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Title:
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METHOD FOR VIA FORMATION IN A SEMICONDUCTOR DEVICE
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Assignee
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| HWA-YA TECHNOLOGY PARK 669, FUHSING 3 ROAD |
| KUEISHAN, TAIWAN |
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Correspondence name and address
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ZHUN LU
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P O BOX 2207
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WILMINGTON, DE 19899
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