Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 071364/0705 | |
| Pages: | 6 |
| | Recorded: | 06/09/2025 | | |
| Attorney Dkt #: | 181074 (RPAT127US) - 1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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07/01/2025
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Application #:
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17757823
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Filing Dt:
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06/21/2022
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Publication #:
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Pub Dt:
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10/26/2023
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PCT #:
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EP2020086022
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Title:
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PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYER
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Assignee
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| 1 ASHLEY ROAD, 3RD FLOOR |
| ALTRINCHAM, CHESHIRE, UNITED KINGDOM WA14 2DT |
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Correspondence name and address
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RACHEL A. VILLALOBOS
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WOMBLE BOND DICKINSON (US) LLP
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P.O. BOX 29001
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GLENDALE, CA 91209-9001
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06/19/2025 09:41 PM
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