Patent Assignment Details
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Reel/Frame: | 012667/0706 | |
| Pages: | 2 |
| | Recorded: | 03/11/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10019299
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Filing Dt:
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03/11/2002
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Title:
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UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE
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Assignee
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7-1, AKETA-CHO |
TAKATSUKI-SHI, OSAKA-FU, JAPAN |
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Correspondence name and address
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JACOBSON HOLMAN PLLC
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WILLIAM E. PLAYER
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400 SEVENTH STREET, N.W.
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WASHINGTON, D.C. 20004
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