Patent Assignment Details
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| Reel/Frame: | 023575/0709 | |
| Pages: | 2 |
| | Recorded: | 11/28/2009 | | |
| Attorney Dkt #: | BDG060 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12626884
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Filing Dt:
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11/28/2009
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Publication #:
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Pub Dt:
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03/25/2010
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER
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Assignee
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| 3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
| TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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10 ANSON ROAD #47-14
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SINGAPORE, 079903 SINGAPORE
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