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Reel/Frame:029114/0710   Pages: 3
Recorded: 10/11/2012
Attorney Dkt #:24061.2192/2012-0390
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/20/2015
Application #:
13561263
Filing Dt:
07/30/2012
Publication #:
Pub Dt:
01/30/2014
Title:
Method of Semiconductor Integrated Circuit Fabrication
Assignors
1
Exec Dt:
07/25/2012
2
Exec Dt:
07/30/2012
3
Exec Dt:
07/30/2012
Assignee
1
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE LLP
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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