Patent Assignment Details
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Reel/Frame: | 013321/0711 | |
| Pages: | 2 |
| | Recorded: | 09/24/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10252378
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Filing Dt:
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09/24/2002
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Publication #:
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Pub Dt:
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01/30/2003
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Title:
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Chip-on-board module, and method of manufacturing the same
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Assignee
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2-3, MARUNOUCHI 2-CHOME |
CHIYODA-KU |
TOKYO 100-8310, JAPAN |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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STEPHEN A. BECKER
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600 13TH ST, N.W.
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WASHINGTON, DC 20005
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