Patent Assignment Details
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| Reel/Frame: | 057377/0711 | |
| Pages: | 12 |
| | Recorded: | 09/02/2021 | | |
| Attorney Dkt #: | JHAP0065USA1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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17465803
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Filing Dt:
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09/02/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Title:
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SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SAME
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Assignee
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| NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY |
| QUANZHOU CITY, FUJIAN PROVINCE, CHINA |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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09/24/2024 06:04 AM
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