Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064503/0711 | |
| Pages: | 11 |
| | Recorded: | 08/06/2023 | | |
| Attorney Dkt #: | 5027-0056US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18276034
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Filing Dt:
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08/06/2023
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Publication #:
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Pub Dt:
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05/16/2024
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Title:
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HEAT BOLT UNIT, DIE LIP ADJUSTING DEVICE, EXTRUSION MOLDING DIE, EXTRUSION MOLDING DEVICE, AND METHOD FOR MANUFACTURING HEAT BOLT UNIT
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Assignees
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 141-0032 |
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| 2-8-2, MINAMIKAMATA |
| OTA-KU, TOKYO, JAPAN 144-0035 |
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Correspondence name and address
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MITCHELL W. SHAPIRO
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1717 PENNSYLVANIA AVENUE, NW
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SUITE 1025
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WASHINGTON, DC 20006
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