Patent Assignment Details
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Reel/Frame: | 007567/0712 | |
| Pages: | 4 |
| | Recorded: | 07/14/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/05/1997
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Application #:
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08466649
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Filing Dt:
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06/06/1995
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Title:
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NOVEL LANDING PAD TECHNOLOGY DOUBLED UP AS LOCAL INTERCONNECT AND BORDERLESS CONTACT FOR DEEP SUB-HALF MICROMETER IC APPLICATION
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Assignee
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ONE AMD PLACE, M/S 68 |
SUNNYVALE, CALIFORNIA 94088 |
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Correspondence name and address
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BENMAN COLLINS & SAWYER
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DAVID W. COLLINS
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711 WEST LOS ALTOS ROAD
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TUCSON, AZ 85704-4105
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