Patent Assignment Details
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Reel/Frame: | 026557/0713 | |
| Pages: | 4 |
| | Recorded: | 07/07/2011 | | |
Attorney Dkt #: | NSC1P435/P07720 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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13157196
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Filing Dt:
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06/09/2011
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Publication #:
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Pub Dt:
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12/13/2012
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Title:
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METHOD AND APPARATUS FOR DICING DIE ATTACH FILM ON A SEMICONDUCTOR WAFER
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Assignee
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER LAW GROUP LLP
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P.O. BOX 1687
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CUPERTINO, CA 95015-1687
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