Patent Assignment Details
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Reel/Frame: | 060327/0713 | |
| Pages: | 14 |
| | Recorded: | 06/28/2022 | | |
Attorney Dkt #: | 2204977CN01-US-DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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17809277
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Filing Dt:
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06/28/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Title:
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SEMICONDUCTOR CHIP
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Assignee
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1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG |
SHANGHAI, CHINA 201209 |
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Correspondence name and address
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LUNG TIN LLC
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228 E 45TH ST STE 605
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NEW YORK, NY 10017
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09/22/2024 04:26 AM
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