Patent Assignment Details
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Reel/Frame: | 022361/0714 | |
| Pages: | 4 |
| | Recorded: | 03/06/2009 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11423551
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Filing Dt:
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06/12/2006
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Publication #:
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Pub Dt:
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12/13/2007
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Title:
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METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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VIET V. TONG
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SCHWEGMAN, LUNDBERG & WOESSNER, P.A.
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P.O. BOX 2938
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MINEAPOLIS, MN 55402-0938
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