Patent Assignment Details
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| Reel/Frame: | 064032/0714 | |
| Pages: | 3 |
| | Recorded: | 06/22/2023 | | |
| Attorney Dkt #: | 224501 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18269187
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Filing Dt:
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06/22/2023
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Publication #:
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Pub Dt:
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05/09/2024
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Title:
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HEAT SEALING FILM, VALVE DEVICE WITH HEAT SEALING FILM, ELECTRICITY STORAGE DEVICE, VALVE STRUCTURE FOR ELECTRICITY STORAGE DEVICE, AND METHOD FOR MANUFACTURING VALVE STRUCTURE FOR ELECTRICITY STORAGE DEVICE
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Assignee
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| 1-1, ICHIGAYA KAGACHO 1-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 162-8001 |
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Correspondence name and address
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EE MING T. BAHK
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OLIFF PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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06/21/2024 05:54 PM
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