Patent Assignment Details
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Reel/Frame: | 007718/0718 | |
| Pages: | 3 |
| | Recorded: | 10/23/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/04/2001
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Application #:
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08116305
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Filing Dt:
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09/03/1993
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Title:
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MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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Assignee
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138 TEXACO ROAD |
QPL INDUSTRIAL BUILDING |
TSUEN WAN, N.T., HONG KONG |
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Correspondence name and address
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EDWARD C. KWOK
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SKJERVEN, MORRILL, MACPHERSON ET AL.
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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