Patent Assignment Details
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| Reel/Frame: | 008949/0718 | |
| Pages: | 3 |
| | Recorded: | 12/23/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/02/2000
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Application #:
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08996654
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Filing Dt:
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12/23/1997
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Title:
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APPARATUS FOR SHAPING LIQUID PORTIONS OF SOLDER IN SOFT SOLDERING SEMICONDUCTOR CHIPS
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Assignee
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| HINTERBERGSTRASSE 32 |
| VH-6330 CHAM, SWITZERLAND |
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Correspondence name and address
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MCCORMICK, PAULDING & HUBER LLP
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JOHN C. LINDERMAN
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185 ASYLUM STREET, 18TH FL.
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CITYPLACE II
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HARTFORD, CT 06103
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