Patent Assignment Details
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Reel/Frame: | 060762/0718 | |
| Pages: | 2 |
| | Recorded: | 08/09/2022 | | |
Attorney Dkt #: | YAS22301 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17884415
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Filing Dt:
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08/09/2022
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Publication #:
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Pub Dt:
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03/09/2023
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Title:
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RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, RESIN MOLDED PRODUCT FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE
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Assignee
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1-1-2, SHIMOHOZUMI |
IBARAKI-SHI, OSAKA, JAPAN 5678680 |
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Correspondence name and address
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ALLEMAN HALL CREASMAN & TUTTLE LLP
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900 SW 5TH AVENUE SUITE 2300
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PORTLAND, OR 97204
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