Patent Assignment Details
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Reel/Frame: | 020195/0719 | |
| Pages: | 4 |
| | Recorded: | 12/04/2007 | | |
Attorney Dkt #: | 9898-624 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/09/2010
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Application #:
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11950251
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Filing Dt:
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12/04/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR CHIP MODULE INCLUDING THE WAFER LEVEL CHIP SCALE PACKAGE
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, |
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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210 SW MORRISON STREET, SUITE 400
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PORTLAND, OR 97204
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