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Patent Assignment Details

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Reel/Frame:	025066/0719			Pages:	8
		Recorded:	09/30/2010
Attorney Dkt #:	TPL-0002
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 12

Patent #:	6911392	Issue Dt:	06/28/2005	Application #:	10228699	Filing Dt:	08/26/2002
Publication #:	US20030113979	Pub Dt:	06/19/2003
Title:	PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS

Patent #:	6894358	Issue Dt:	05/17/2005	Application #:	10228804	Filing Dt:	08/26/2002
Publication #:	US20040214380	Pub Dt:	10/28/2004
Title:	Process for producing microelectromechanical components and a housed microelectromechanical component

Patent #:	7160478	Issue Dt:	01/09/2007	Application #:	10487604	Filing Dt:	08/13/2004
Publication #:	US20040256349	Pub Dt:	12/23/2004
Title:	METHOD FOR PRODUCING ELECTRONIC COMPONENTS

Patent #:	7700397	Issue Dt:	04/20/2010	Application #:	10580284	Filing Dt:	06/25/2007
Publication #:	US20080038868	Pub Dt:	02/14/2008
Title:	PROCESS FOR PACKAGING COMPONENTS, AND PACKAGED COMPONENTS

Patent #:	7700957	Issue Dt:	04/20/2010	Application #:	10947974	Filing Dt:	09/22/2004
Publication #:	US20050042786	Pub Dt:	02/24/2005
Title:	PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS

Patent #:	7071521	Issue Dt:	07/04/2006	Application #:	10994659	Filing Dt:	11/22/2004
Publication #:	US20050064644	Pub Dt:	03/24/2005
Title:	PROCESS FOR PRODUCING MICROELECTROMECHANICAL COMPONENTS AND A HOUSED MICROELECTROMECHANICAL COMPONENT

Patent #:	7285834	Issue Dt:	10/23/2007	Application #:	11378962	Filing Dt:	03/18/2006
Publication #:	US20060160258	Pub Dt:	07/20/2006
Title:	PROCESS FOR PRODUCING MICROELECTROMECHANICAL COMPONENTS AND A HOUSED MICROELECTROMECHANICAL COMPONENT

Patent #:	8114304	Issue Dt:	02/14/2012	Application #:	11603388	Filing Dt:	11/22/2006
Publication #:	US20070063202	Pub Dt:	03/22/2007
Title:	METHOD FOR PRODUCING ELECTRONIC COMPONENTS

Patent #:	7821106	Issue Dt:	10/26/2010	Application #:	12042108	Filing Dt:	03/04/2008
Publication #:	US20080150063	Pub Dt:	06/26/2008
Title:	PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS

Patent #:	8017435	Issue Dt:	09/13/2011	Application #:	12307174	Filing Dt:	11/05/2009
Publication #:	US20100059877	Pub Dt:	03/11/2010
Title:	METHOD FOR PACKAGING ELECTRONIC DEVICES AND INTEGRATED CIRCUITS

Patent #:	7880179	Issue Dt:	02/01/2011	Application #:	12623323	Filing Dt:	11/20/2009
Publication #:	US20100065883	Pub Dt:	03/18/2010
Title:	PROCESS FOR MAKING CONTACT WITH AND HOUSING INTEGRATED CIRCUITS

Patent #:	8309384	Issue Dt:	11/13/2012	Application #:	12753514	Filing Dt:	04/02/2010
Publication #:	US20100187669	Pub Dt:	07/29/2010
Title:	PROCESS FOR PACKAGING COMPONENTS, AND PACKAGED COMPONENTS

Assignor

Exec Dt:

07/25/2007

Assignee

BLOCK 209 WOODLANDS AVE 9

#01-57 / 58 WOODLANDS SPECTRUM II

SINGAPORE, SINGAPORE 738959

Correspondence name and address
	MARK SALVATORE
	20883 STEVENS CREEK BOULEVARD
	SUITE 100
	CUPERTINO, CA 95014

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