Patent Assignment Details
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| Reel/Frame: | 017407/0722 | |
| Pages: | 3 |
| | Recorded: | 12/22/2005 | | |
| Attorney Dkt #: | 2519-0218pus1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11313858
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Filing Dt:
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12/22/2005
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Publication #:
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Pub Dt:
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12/14/2006
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Title:
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Method for forming wafer-level heat spreader structure and package structure thereof
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Assignee
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| 26, CHIN 3RD RD., 811 NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN 811, R.O.C. |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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BIRCH STEWART KOLASCH, ET AL.
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8110 GATEHOUSE ROAD, SUITE 100 EAST
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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