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Patent Assignment Details
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Reel/Frame:008944/0723   Pages: 3
Recorded: 01/16/1998
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/08/1998
Application #:
08488063
Filing Dt:
06/07/1995
Title:
WAFER SUPPORT STRUCTURE FOR A WAFER BACKPLANE WITH A CURVED SURFACE
Assignor
1
Exec Dt:
01/07/1998
Assignees
1
6-7-35 KITASHINAGAWA SHINAGAWA KU
TOKYO, JAPAN
2
2120 W. GUADALUPE ROAD
GILBERT, ARIZONA 85233
Correspondence name and address
WOOD, HERRON & EVANS, L.L.P.
KURT A. SUMME
2700 CAREW TOWER
441 VINE STREET
CINCINNATI, OH 45202

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