Patent Assignment Details
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Reel/Frame: | 048521/0723 | |
| Pages: | 4 |
| | Recorded: | 03/06/2019 | | |
Attorney Dkt #: | 5521-0202PUS1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16330574
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Filing Dt:
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03/05/2019
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Publication #:
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Pub Dt:
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09/16/2021
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Title:
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THERMAL CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD
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SUITE 100E
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FALLS CHURCH, VA 22042
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09/22/2024 06:51 PM
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