Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049767/0723 | |
| Pages: | 6 |
| | Recorded: | 07/16/2019 | | |
| Attorney Dkt #: | 1012-2483 / 2018P50440 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16452777
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Filing Dt:
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06/26/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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06/14/2024 03:23 AM
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