Patent Assignment Details
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Reel/Frame: | 026374/0724 | |
| Pages: | 6 |
| | Recorded: | 06/02/2011 | | |
Attorney Dkt #: | A8319.0029/P029-A |
Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11657280
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Filing Dt:
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01/24/2007
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Publication #:
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Pub Dt:
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05/24/2007
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Title:
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WIRING GLASS SUBSTRATE FOR CONNECTING A SEMICONDUCTOR CHIP TO A PRINTED WIRING SUBSTRATE AND A SEMICONDUCTOR MODULE HAVING THE WIRING GLASS SUBSTRATE
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Assignee
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1753, SHIMONUMABE, NAKAHARA-KU |
KAWASAKI-SHI, KANAGAWA, JAPAN |
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Correspondence name and address
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DICKSTEIN SHAPIRO LLP
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1825 EYE STREET, NW
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WASHINGTON, DC 20006
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