Patent Assignment Details
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Reel/Frame: | 035259/0724 | |
| Pages: | 3 |
| | Recorded: | 03/26/2015 | | |
Attorney Dkt #: | T5057-B102UA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/01/2017
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Application #:
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14636866
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Filing Dt:
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03/03/2015
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Publication #:
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Pub Dt:
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06/25/2015
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Title:
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THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) HAVING A THERMALLY ENHANCED HEAT SPREADER EMBEDDED IN A SUBSTRATE
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Assignee
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NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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LOWE HAUPTMAN & HAM, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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