Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 046374/0728 | |
| Pages: | 9 |
| | Recorded: | 07/17/2018 | | |
| Attorney Dkt #: | 70027-2284 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/20/2018
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Application #:
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15433866
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Filing Dt:
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02/15/2017
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Publication #:
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Pub Dt:
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06/08/2017
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED PAD ON LAYERED SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4340 STEVENS CREEK BLVD.
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SUITE 106
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SAN JOSE, CA 95129
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