Patent Assignment Details
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| Reel/Frame: | 061601/0729 | |
| Pages: | 11 |
| | Recorded: | 10/31/2022 | | |
| Attorney Dkt #: | 965RO0032US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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12634663
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Filing Dt:
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12/09/2009
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Title:
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METHOD AND STRUCTURE OF WAFER LEVEL ENCAPSULATION OF INTEGRATED CIRCUITS WITH CAVITY
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Assignee
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| 2570 NORTH FIRST STREET, SUITE 300 |
| SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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AMPACC LAW GROUP, PLLC
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6100 219TH ST SW #580
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MOUNTLAKE TERRACE, WA 98043
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