Patent Assignment Details
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| Reel/Frame: | 013474/0730 | |
| Pages: | 7 |
| | Recorded: | 11/07/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10289312
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Filing Dt:
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11/07/2002
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Publication #:
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Pub Dt:
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09/04/2003
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Title:
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Method of metal electro-plating for IC package substrate
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Assignee
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| 9, CHUNG-SAN ROAD |
| N.E.P.Z. |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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FU-YU HUANG
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PO BOX 82-144
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TAIPEI, TAIWAN
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