Patent Assignment Details
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Reel/Frame: | 043362/0730 | |
| Pages: | 17 |
| | Recorded: | 07/28/2017 | | |
Attorney Dkt #: | S&P-51434 |
Conveyance: | CHANGE OF PATENTEE'S ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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13982697
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Filing Dt:
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10/17/2013
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Publication #:
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Pub Dt:
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02/20/2014
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Title:
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BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY
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Assignee
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77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO-SHI |
KYOTO, JAPAN 601-8366 |
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Correspondence name and address
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PEARNE & GORDON LLP
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1801 EAST 9TH STREET, SUITE 1200
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CLEVELAND, OH 44114
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