Patent Assignment Details
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| Reel/Frame: | 071770/0730 | |
| Pages: | 2 |
| | Recorded: | 06/30/2025 | | |
| Attorney Dkt #: | TWT11110/US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/14/2018
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Application #:
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15782285
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Filing Dt:
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10/12/2017
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Title:
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ELECTRONIC PACKAGE MODULE
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Assignee
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| NO. 270, NANFENG RD., PINGZHEN DIST. |
| TAOYUAN CITY, TAIWAN 324 |
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Correspondence name and address
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CHI-FENG HSU
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12345 LAKE CITY WAY NE, NO. 283
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SEATTLE, WA 98125
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10/07/2025 05:12 AM
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