Patent Assignment Details
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| Reel/Frame: | 029919/0731 | |
| Pages: | 4 |
| | Recorded: | 03/05/2013 | | |
| Attorney Dkt #: | US46733 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13784852
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Filing Dt:
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03/05/2013
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Publication #:
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Pub Dt:
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03/27/2014
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Title:
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THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME
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Assignees
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| AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE |
| ZHONGSHAN, CHINA |
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| 66, CHUNG SHAN ROAD, TU-CHENG DIST. |
| NEW TAIPEI, TAIWAN |
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Correspondence name and address
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RAYMOND J. CHEW
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1203 W. IMPERIAL HWY SUITE 100
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BREA, CA 92821
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