Patent Assignment Details
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Reel/Frame: | 052374/0731 | |
| Pages: | 5 |
| | Recorded: | 04/13/2020 | | |
Attorney Dkt #: | 43747.0004.CIP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/2023
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Application #:
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16748860
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Filing Dt:
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01/22/2020
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Publication #:
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Pub Dt:
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07/30/2020
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Title:
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METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
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Assignee
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21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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HUAN-YI LIN
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17F., NO. 59, SEC. 2, DUNHUA S. RD., DAAN DIST.,
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TAIPEI CITY, 106 TAIWAN
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