Patent Assignment Details
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| Reel/Frame: | 026290/0732 | |
| Pages: | 3 |
| | Recorded: | 05/17/2011 | | |
| Attorney Dkt #: | 18506-475 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13109284
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Filing Dt:
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05/17/2011
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Publication #:
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Pub Dt:
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09/08/2011
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Title:
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HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME
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Assignee
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| NO.24-1, INDUSTRY E. RD. 4TH, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
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1100 QUAIL STREET, SUITE 202
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NEWPORT BEACH, CA 92660
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