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Reel/Frame:004895/0733   Pages: 1
Recorded: 05/10/1988
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
02/28/1989
Application #:
07192343
Filing Dt:
05/10/1988
Title:
METHOD OF FORMING COMPLETELY METALLIZED VIA HOLES IN SEMICONDUCTORS
Assignors
1
Exec Dt:
04/04/1988
2
Exec Dt:
04/04/1988
3
Exec Dt:
04/04/1988
Assignee
1
Correspondence name and address
LIMBACH, LIMBACH & SUTTON
ATTN: THOMAS B. HAVERSTOCK
2001 FERRY BLDG.
SAN FRANCISCO, CA 94111

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