Patent Assignment Details
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Reel/Frame: | 028993/0733 | |
| Pages: | 2 |
| | Recorded: | 09/20/2012 | | |
Attorney Dkt #: | MING0117PUSP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/15/2014
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Application #:
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13078391
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Filing Dt:
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04/01/2011
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Publication #:
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Pub Dt:
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10/06/2011
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Title:
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WAFER FLATTENING APPARATUS AND METHOD
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Assignee
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10 TSUTSUMISOTO-CHO |
NISHIKYOGOKU |
UKYO-KU, KYOTO, JAPAN 615-0854 |
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Correspondence name and address
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BROOKS KUSHMAN P.C.
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1000 TOWN CENTER
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TWENTY-SECOND FLOOR
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SOUTHFIELD, MI 48075
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