Patent Assignment Details
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Reel/Frame: | 012713/0734 | |
| Pages: | 4 |
| | Recorded: | 03/19/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10100658
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Filing Dt:
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03/18/2002
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Title:
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METHOD FOR MAKING MULTICHIP MODULE SUBSTRATES BY ENCAPSULATING ELECTRICAL CONDUCTORS
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Assignee
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P.O. BOX 8 |
BLDG. K1, ROOM 4A168 |
SCHENECTADY, NEW YORK 12301 |
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Correspondence name and address
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DUANE MORRIS LLP
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WILLIAM H. MEISE
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100 COLLEGE ROAD WEST, SUITE 100
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PRINCETON, NJ 08540
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