Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 045711/0734 | |
| Pages: | 4 |
| | Recorded: | 05/03/2018 | | |
Attorney Dkt #: | 00258.0023-00258.0030 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
8
|
|
Patent #:
|
|
Issue Dt:
|
04/16/2019
|
Application #:
|
15279236
|
Filing Dt:
|
09/28/2016
|
Publication #:
|
|
Pub Dt:
|
05/04/2017
| | | | |
Title:
|
SUBSTRATE HAVING TWO SEMICONDUCTOR MATERIALS ON INSULATOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2019
|
Application #:
|
15280214
|
Filing Dt:
|
09/29/2016
|
Publication #:
|
|
Pub Dt:
|
04/13/2017
| | | | |
Title:
|
TRANSISTOR AND METHOD FOR FORMING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2019
|
Application #:
|
15371968
|
Filing Dt:
|
12/07/2016
|
Publication #:
|
|
Pub Dt:
|
06/15/2017
| | | | |
Title:
|
RESONATOR AND RELATED MANUFACTURING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2020
|
Application #:
|
15416828
|
Filing Dt:
|
01/26/2017
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
Title:
|
Manufacturing of Thin-Film Bulk Acoustic Resonator and Semiconductor Apparatus Comprising the Same
|
|
|
Patent #:
|
|
Issue Dt:
|
06/23/2020
|
Application #:
|
15453364
|
Filing Dt:
|
03/08/2017
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
Title:
|
Manufacturing of Thin-Film Bulk Acoustic Resonator and Semiconductor Apparatus Comprising the Same
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2020
|
Application #:
|
15453728
|
Filing Dt:
|
03/08/2017
|
Publication #:
|
|
Pub Dt:
|
09/14/2017
| | | | |
Title:
|
RESONATOR AND RELATED MANUFACTURING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2020
|
Application #:
|
15716261
|
Filing Dt:
|
09/26/2017
|
Publication #:
|
|
Pub Dt:
|
05/31/2018
| | | | |
Title:
|
Method of Manufacturing an Interconnect Structure by Forming Metal Layers in Mask Openings
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2019
|
Application #:
|
15816973
|
Filing Dt:
|
11/17/2017
|
Publication #:
|
|
Pub Dt:
|
05/31/2018
| | | | |
Title:
|
METHOD OF FORMING INTERCONNECT STRUCTURE WITH PARTIAL COPPER PLATING
|
|
Assignees
|
|
|
18 ZHANGJIANG ROAD, PUDONG NEW AREA |
SHANGHAI, CHINA 201203 |
|
|
|
9TH FLOOR, NO. 700 SIMINGSHAN ROAD, BEILUN DISTRICT |
NINGBO, CHINA 315800 |
|
Correspondence name and address
|
|
ANOVA LAW GROUP PLLC
|
|
21495 RIDGETOP CIRCLE, SUITE 300
|
|
STERLING, VA 20166
|
Search Results as of:
06/19/2024 11:37 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|