Patent Assignment Details
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Reel/Frame: | 012671/0735 | |
| Pages: | 4 |
| | Recorded: | 01/31/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10062896
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Filing Dt:
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01/31/2002
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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Method of manufacturing an encapsulated integrated circuit package
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Assignee
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138 TEXACO ROAD |
QPL INDUSTRIAL BUILDING |
TSUEN WAN, NT, HONG KONG |
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Correspondence name and address
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MILBANK TWEED HADLEY & MCCLOY LLP
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CHRISTOPHER J. GASPAR
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ONE CHASE MANHATTAN PLAZA
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NEW YORK, NY 10005
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