Patent Assignment Details
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Reel/Frame: | 023349/0736 | |
| Pages: | 3 |
| | Recorded: | 10/08/2009 | | |
Attorney Dkt #: | NTCP0324USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12576220
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Filing Dt:
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10/08/2009
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Publication #:
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Pub Dt:
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04/14/2011
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Title:
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SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME
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Assignee
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HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN |
TAO-YUAN HSIEN, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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