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Patent Assignment Details
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Reel/Frame:063698/0736   Pages: 4
Recorded: 05/19/2023
Attorney Dkt #:819017
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17790763
Filing Dt:
07/05/2022
Publication #:
Pub Dt:
02/02/2023
Title:
ENCAPSULATION SYSTEM FOR AN OPTOELECTRONIC COMPONENT COMPRISING AT LEAST A FIRST ENCAPSULATION AND A SECOND ENCAPSULATION, AND OPTOELECTRONIC COMPONENT COMPRISING AN ENCAPSULATION SYSTEM OF THIS KIND
Assignor
1
Exec Dt:
05/04/2023
Assignee
1
TREIDLERSTRASSE 3
DRESDEN, GERMANY 01139
Correspondence name and address
LEYDIG, VOIT & MAYER, LTD.
TWO PRUDENTIAL PLAZA, SUITE 4900
180 NORTH STETSON AVENUE
CHICAGO, IL 606016731

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