Patent Assignment Details
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Reel/Frame: | 014733/0737 | |
| Pages: | 3 |
| | Recorded: | 06/15/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2005
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Application #:
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10757499
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Filing Dt:
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01/15/2004
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Title:
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ELECTRONIC COMPONENTS SUCH AS THIN ARRAY PLASTIC PACKAGES AND PROCESS FOR FABRICATING SAME
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Assignee
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QPL INDUSTRIAL BUILDING, 14TH FLOOR, 138 TEXACO ROAD, TSUEN WAN |
NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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KEATING & BENNETT LLP
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JOSEPH R. KEATING, ESQ.
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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