Patent Assignment Details
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Reel/Frame: | 020457/0737 | |
| Pages: | 2 |
| | Recorded: | 02/02/2008 | | |
Attorney Dkt #: | TW-WPA-0735 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12025021
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Filing Dt:
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02/02/2008
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Publication #:
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Pub Dt:
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08/06/2009
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Title:
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Fully Cu-metallized III-V group compound semiconductor device with palladium/germanium/copper ohmic contact system
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Assignee
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NO. 1001, TA HSUEH RD. |
HSINCHU, TAIWAN |
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Correspondence name and address
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SINORICA, LLC
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528 FALLSGROVE DRIVE
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ROCKVILLE, MD 20850
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09/23/2024 03:07 AM
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