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Reel/Frame:012245/0739   Pages: 3
Recorded: 10/15/2001
Conveyance: RECORD TO CORRECT ASSIGNEE'S ADDRESS ON A DOCUMENT PREVIOUSLY RECORDED AT REEL 010533 FRAME 0596. (ASSIGNOR CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST TO SAID ASSIGNEE)
Total properties: 1
1
Patent #:
Issue Dt:
01/29/2002
Application #:
09492820
Filing Dt:
01/28/2000
Title:
Low-Pin-Count Chip Package And Manufacturing Method Thereof
Assignors
1
Exec Dt:
11/24/1999
2
Exec Dt:
11/24/1999
3
Exec Dt:
11/24/1999
Assignee
1
NANTZE EXPORT PROCESSING ZONE
NO. 26, CHIN 3RD ROAD
KAOSHIUNG, TAIWAN R.O.C
Correspondence name and address
LOWE HAUPTMAN GILMAN & BERNER
BENJAMIN J. HAUPTMAN
1700 DIAGONAL ROAD,
SUITE 310
ALEXANDRIA VA. 22314

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