Patent Assignment Details
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Reel/Frame: | 030547/0739 | |
| Pages: | 5 |
| | Recorded: | 06/04/2013 | | |
Attorney Dkt #: | 15524NS-000356/US/NP |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 030235 FRAME 0453. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE'S ADDRESS SHOULD BE #105, GEUMIL-RO 965 BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/2015
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Application #:
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13879911
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Filing Dt:
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04/17/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Title:
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SEMICONDUCTOR CHIP PACKAGE HAVING VIA HOLE AND SEMICONDUCTOR MODULE THEREOF
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Assignee
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#105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, |
EUMSEONG-GUN, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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