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Total properties:
23
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Patent #:
|
|
Issue Dt:
|
06/06/2000
|
Application #:
|
09127762
|
Filing Dt:
|
07/31/1998
|
|
Title:
|
ETCHING PROCESS FOR PRODUCING SUBSTANTIALLY UNDERCUT FREE SILICON ON INSULATOR STRUCTURES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09239723
|
Filing Dt:
|
01/29/1999
|
|
Title:
|
MORPHED PROCESSING OF SEMICONDUCTOR DEVICES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/01/2003
|
Application #:
|
09658023
|
Filing Dt:
|
09/08/2000
|
|
Title:
|
MAGNETIC POLE FABRICATION PROCESS AND DEVICE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/15/2003
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Application #:
|
09696739
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Filing Dt:
|
10/26/2000
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|
Title:
|
MAGNETIC POLE FABRICATION PROCESS AND DEVICE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/12/2003
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Application #:
|
09846214
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Filing Dt:
|
05/02/2001
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|
Publication #:
|
|
Pub Dt:
|
11/07/2002
| | | | |
|
Title:
|
METHOD FOR THIN FILM LIFT-OFF PROCESSES USING LATERAL EXTENDED ETCHING MASKS AND DEVICE
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|
|
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Patent #:
|
|
Issue Dt:
|
08/03/2004
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Application #:
|
10163567
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Filing Dt:
|
06/06/2002
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Publication #:
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|
Pub Dt:
|
01/30/2003
| | | | |
|
Title:
|
PERIMETER SEAL FOR BACKSIDE COOLING OF SUBSTRATES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10277261
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Filing Dt:
|
10/22/2002
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|
Publication #:
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|
Pub Dt:
|
04/24/2003
| | | | |
|
Title:
|
Etching of thin damage sensitive layers using high frequency pulsed plasma
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/03/2006
|
Application #:
|
10770839
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Filing Dt:
|
02/02/2004
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|
Publication #:
|
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Pub Dt:
|
09/09/2004
| | | | |
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Title:
|
END POINT DETECTION IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2006
|
Application #:
|
10815965
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Filing Dt:
|
03/31/2004
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|
Publication #:
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|
Pub Dt:
|
11/25/2004
| | | | |
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Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10839809
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Filing Dt:
|
05/03/2004
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|
Publication #:
|
|
Pub Dt:
|
12/23/2004
| | | | |
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Title:
|
ETCHING OF CHROMIUM LAYERS ON PHOTOMASKS UTILIZING HIGH DENSITY PLASMA AND LOW FREQUENCY RF BIAS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/05/2006
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Application #:
|
10841818
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Filing Dt:
|
05/06/2004
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|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
|
Title:
|
ENVELOPE FOLLOWER END POINT DETECTION IN TIME DIVISION MULTIPLEXED PROCESSES
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
10968823
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Filing Dt:
|
10/18/2004
|
|
Publication #:
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|
Pub Dt:
|
05/26/2005
| | | | |
|
Title:
|
Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulation
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2008
|
Application #:
|
11155904
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Filing Dt:
|
06/20/2005
|
|
Publication #:
|
|
Pub Dt:
|
12/01/2005
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
11159415
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Filing Dt:
|
06/23/2005
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2005
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR REDUCING ASPECT RATIO DEPENDENT ETCHING IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11210248
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Filing Dt:
|
08/23/2005
|
|
Publication #:
|
|
Pub Dt:
|
01/12/2006
| | | | |
|
Title:
|
Selection of wavelengths for end point in a time division multiplexed process
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
11229319
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Filing Dt:
|
09/16/2005
|
|
Publication #:
|
|
Pub Dt:
|
04/06/2006
| | | | |
|
Title:
|
METHOD & APPARATUS TO IMPROVE PLASMA ETCH UNIFORMITY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11441811
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Filing Dt:
|
05/26/2006
|
|
Publication #:
|
|
Pub Dt:
|
12/21/2006
| | | | |
|
Title:
|
PROCESS CHANGE DETECTION THROUGH THE USE OF EVOLUTIONARY ALGORITHMS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2010
|
Application #:
|
11502585
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Filing Dt:
|
08/10/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/22/2007
| | | | |
|
Title:
|
OPTICAL EMISSION INTERFEROMETRY FOR PECVD USING A GAS INJECTION HOLE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
11634377
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Filing Dt:
|
12/04/2006
|
|
Publication #:
|
|
Pub Dt:
|
06/21/2007
| | | | |
|
Title:
|
METHOD FOR ETCHING PHOTOLITHOGRAPHIC SUBSTRATES
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11681004
|
Filing Dt:
|
04/16/2007
|
|
Publication #:
|
|
Pub Dt:
|
08/02/2007
| | | | |
|
Title:
|
Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias Modulation
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11681805
|
Filing Dt:
|
03/05/2007
|
|
Publication #:
|
|
Pub Dt:
|
09/20/2007
| | | | |
|
Title:
|
Apparatus and Method for Carrying Substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
11756074
|
Filing Dt:
|
05/31/2007
|
|
Publication #:
|
|
Pub Dt:
|
06/26/2008
| | | | |
|
Title:
|
TEMPERATURE CONTROL METHOD FOR PHOTOLITHOGRAPHIC SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2010
|
Application #:
|
11834127
|
Filing Dt:
|
08/06/2007
|
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
|
Title:
|
METHOD FOR PLASMA ETCHING OF POSITIVELY SLOPED STRUCTURES
|
|
