Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 066292/0741 | |
| Pages: | 6 |
| | Recorded: | 01/30/2024 | | |
Attorney Dkt #: | 27662US02-US04 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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11/02/2010
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Application #:
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12387672
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Filing Dt:
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05/05/2009
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
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06/19/2012
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Application #:
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12924493
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Filing Dt:
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09/27/2010
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Patent #:
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Issue Dt:
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01/14/2014
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Application #:
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13487705
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Filing Dt:
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06/04/2012
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Title:
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STACKED REDISTRIBUTION LAYER (RDL) DIE ASSEMBLY PACKAGE
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Assignee
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1900 SOUTH PRICE ROAD |
CHANDLER, ARIZONA 85248-1604 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 W. MADISON ST
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34TH FLOOR
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CHICAGO, IL 60661
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