Patent Assignment Details
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| Reel/Frame: | 023984/0742 | |
| Pages: | 6 |
| | Recorded: | 02/24/2010 | | |
| Attorney Dkt #: | 268262 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12599847
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Filing Dt:
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11/12/2009
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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Method For Applying A Thin-Film Encapsulation Layer Assembly To An Organic Device, And An Organic Device Provided With A Thin-Film Encapsulation Layer Assembly Preferably Applied With Such A Method
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Assignee
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| LUCHTHAVENWEG 10 |
| EINDHOVEN, NETHERLANDS 5657 EB |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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180 N. STETSON
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SUITE 4900
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CHICAGO, IL 60601
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