Patent Assignment Details
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Reel/Frame: | 060664/0742 | |
| Pages: | 6 |
| | Recorded: | 07/29/2022 | | |
Attorney Dkt #: | SEC.4916 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17875889
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Filing Dt:
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07/28/2022
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Publication #:
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Pub Dt:
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03/09/2023
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Title:
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SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA (TSV) TEST DEVICE AND OPERATING METHOD THEREOF
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Assignees
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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50, YONSEI-RO, SEODAEMUN-GU |
SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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VOLENTINE, WHITT & FRANCOS, PLLC
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300 E MAIN ST., SUITE 302
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CHARLOTTESVILLE, VA 22902
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09/22/2024 03:11 PM
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