Patent Assignment Details
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| Reel/Frame: | 046618/0743 | |
| Pages: | 4 |
| | Recorded: | 08/10/2018 | | |
| Attorney Dkt #: | ONS02055D01US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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16101259
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Filing Dt:
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08/10/2018
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Publication #:
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Pub Dt:
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12/06/2018
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Title:
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THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
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Assignee
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| 5005 E. MCDOWELL RD. |
| MD A700 |
| PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD, MAILDROP A700
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MD A700
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PHOENIX, AZ 85008
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