Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 038913/0744 | |
| Pages: | 4 |
| | Recorded: | 06/14/2016 | | |
| Attorney Dkt #: | 010829-9182.US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2018
|
Application #:
|
15181212
|
Filing Dt:
|
06/13/2016
|
|
Publication #:
|
|
Pub Dt:
|
12/14/2017
| | | | |
|
Title:
|
Semiconductor device assembly with through-mold cooling channel formed in encapsulant
|
|
|
Assignee
|
|
|
|
|
| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
|
|
Correspondence name and address
|
| |
PERKINS COIE LLP
|
| |
P.O. BOX 1247
|
| |
PATENT PROCUREMENT
|
| |
SEATTLE, WA 98111-1247
|
Search Results as of:
09/21/2024 02:29 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
