Patent Assignment Details
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Reel/Frame: | 022505/0748 | |
| Pages: | 5 |
| | Recorded: | 04/06/2009 | | |
Attorney Dkt #: | 09SD-003 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2012
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Application #:
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12418637
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Filing Dt:
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04/06/2009
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Publication #:
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Pub Dt:
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10/15/2009
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE HAVING UNDERFILL RESIN FORMED WITHOUT VOID BETWEEN SEMICONDUCTOR CHIP AND WIRING BOARD
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Assignee
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80, OSHIMADA-MACHI, NAGANO-SHI, |
NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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IPUSA, P.L.L.C
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1054 31ST STREET, N.W.
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SUITE 400
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WASHINGTON, DC 20007
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